Description |
It starts with an introduction to evaporation deposition, gives some general information, talks about the mechanism and product properties. It ends with talking about advantages and disadvantages. |
Mental Challenge |
The word doesn’t show any difference from PVD. What is their difference? |
Quizzes and Activities |
Activity: Calculate the required temperature for copper as a source material to vaporize. |
Further Reading Sources |
2. Evaporative deposition patterns: Spatial dimensions of the deposit |
| PVD Method | 03:53 | |
| Thermal Evaporation | 10:37 | |
| Sputtering | 07:52 | |
| Electron Beam PVD | 11:00 |
| CVD Method | 09:27 | |
| CVD Types | 06:12 | |
| PECVD Method | 21:26 | |
| MOCVD Method | 19:21 |
| Sol-Gel Method | 06:57 | |
| Sol-Gel Stages | 11:09 | |
| Effective Parameters of Sol-Gel | 17:25 | |
| Applications of Aerogel | 18:54 |
| Molecular Self-Assembly | 18:25 | |
| Nanoparticle Self-Assembly | 15:52 | |
| Self-Assembly Technique | 19:13 |
| Chemical Solution Deposition | 17:39 | |
| Chemical Precipitation | 20:09 | |
| Polyols | 16:10 | |
| Emulsion Method | 18:18 | |
| Sonochemical Method | 18:15 | |
| Thermal Decomposition Method | 17:25 | |
| Microwave Method | 25:30 | |
| Hydrothermal Method | 20:57 | |
| Solvothermal Method | 11:34 |
| Electrochemical Methods | 07:05 | |
| Oxidation and Reduction Affinity | 11:52 | |
| Standard Potential | 17:54 | |
| Electrochemical Deposition | 14:31 | |
| Electrochemical Deposition Methods and Voltage Effects | 15:02 | |
| Anodizing 1 | 14:37 | |
| Anodizing 2 | 17:11 |
| Spinning Processes | 15:49 | |
| Electrospinning Parameters | 22:10 |